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OSP With the exception of the first generation of organic coatings, which were mono layers of approx 40 in thickness and were very sensitive to handling/storage, the current generation of OSP coatings are robust and have excellent shelf life. (See Fig. 42.12 Their ultimate failure is a gradual break down of the deposit and subsequent formation of copper oxide. Even as this occurs, the reduction in solderability performance is not as dramatic as with other surface finishes naturally occurring copper oxide not being very tenacious and/or hard to reduce. I Sn This is one of the more difficult surface finishes to correctly apply and maintain from a chemical view point. As such, the possibilities for solderability defects are many. Both the basis metal (copper) and the I Sn deposit have a natural affinity for one another. The copper migrates through the tin as a function of time and temperature; the hotter the temperature the shorter the time to reach the surface. Once there, the intermetallic oxidizes and becomes non-solderable. As a function of plating, copper is displaced from the surface of the PWB and contaminates the plating bath; potentially reducing the mean time for copper to reach the surface of the part. The deposit thickness likewise plays a crucial role in determining shelf life the thinner the deposit, the shorter the shelf life all things being equal. In addition to this, the catalyst used to make the plating chemistry work (Thiourea) can

0. 0 37 5 0. 75 1. 12 5 1. 5 1. 87 5 2. 25 2. 62 5 6. 6 37 5 6. 7 7. 5 12 5 7. 5 7. 87 5 8. 25 8. 62 5 3. 3 37 5 3. 75 4. 12 5 4. 5 4. 87 5 5. 25 5. 62 5 9. 9 37 5 9. 75

FIGURE 42.10 A gradual reduction in wetting forces over 629 days of correct storage for Immerssion Silver (I Ag) is shown.

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You also need a 5-V power supply or at least three 1.5-V cells arranged in series to get about 4.5 V which is suitable for running this circuit. , Figure 6.1 illustrates the circuit diagram. The circuit is not fancy at all. After you put the programmed chip into the socket and power the circuit, the LED should glow. Now press the switch connected to the reset pin and the LED should be turned off. Release the switch and the LED should glow again. This indicates that the program is running and it is the program that is lighting up the LED. The circuit operates at 4 MHz using the external crystal. If you have a AT90S1200A part, then the oscillator components are not required and you can omit the crystal and the 22-pF capacitors. The AT90S1200A has the internal RC oscillator clock enabled, and the processor then runs at about 1 MHz at 5-V supply voltage. The clock speed is not critical in this particular case. The following program is also available on the CD in the code directory as file ledlight.asm.

break down and co-deposit sulfur into the tin, which will destroy solderability. This co-deposition may not be seen with a standard solderability test even a wetting balance test as it requires the heat from a first pass assembly process to move the sulfur to the surface, which then destroys the solderability of the deposit. It is recommended that thermal stressing of the deposit is used in conjunction with wetting balance testing to ensure that the deposit is robust and free of sulfur. Finally, I Sn has two oxides SnO and SnO2 the former easily reducible and solderable, the latter not. SnO2 can occur due to poor bath maintenance or poor rinsing control. Again the use of stressing techniques, such as 8 hours of 72 C/85 percent R.H., is recommended to help detect the presence of such surface oxides. (See Fig. 42.13 for an example of I Sn gradual decline). Direct Immersion Gold (DIG) This is a relatively unknown deposit, but one with major potential. The application of a special immersion gold deposit does not corrode the underlying copper, and based on the density of the deposit it performs more like a 30 microinch deposit rather than the 3 microinch deposit it actually is.The underlying copper does migrate through the gold eventually, but it takes many years under normal storage conditions and the failure mode is a simple copper oxidation that is easier to reduce than a passivated nickel layer. (See Fig. 42.14).

10 30

0 0 0.38 0.75 1.13 1.5 1.88 2.25 2.63 3 3.38 3.75 4.13 4.5 4.88 5.25 5.63 6 6.38 6.75 7.13 7.5 7.88 8.25 8.63 9 9.38 9.75

FIGURE 42.11 The gradual decrease in wetting forces for ENIG can be seen as a function of the passivivation of the underlying nickel. The deposit, after 842 days of unprotected storage continues to wet under 0.5 seconds, but the exterior metal (immersion gold) is by definition porous and will eventually deteriorate.

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